Senior Package-Silicon Integration Engineer (AI-Driven)

Micron Technology, Inc. invites a Staff Engineer, Package-Silicon Integration to advance next‑generation NAND packaging technology. You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate CPI risks. You will lead complex technical workstreams, develop integration solutions, and apply data‑driven methods including AI-enabled analytics to accelerate learning and ensure robust design and manufacturing. J-18808-Ljbffr